AMD Athlon 64 3200+ OEM ADA3200DAA4BW

Основные характеристики
Тип процессора	Athlon 64
Тип разъема	Socket 939
Разрядность процессора	64
Тактовая частота, МГц	2000
Частота шины, МГц	1000
Ядро процессора
Ядро	Venice
Количество ядер	1
Технология, нм	90
Кэш
Кэш L1, Kb	128
Кэш L2, Kb	512
Дополнительно
Напряжение питания, В	1.35-1.4
Stepping	E6
Hyper-Threading
Упаковка	OEM

AMD SMS3600HAX3DN Sempron 3600+ Mobile 2.0GHz CPU

Part Description	AMD Sempron 3600+ Mobile 2.0GHz CPU
Part Number	SMS3600HAX3DN
Package Type	638-pin lidless micro-PGA, (Socket S1)
Bus speed	800MHz HyperTransport
L2 cache size	256KB
Info.	Size: 1.38" x 1.38" (3.5 cm x 3.5 cm)

AMD TMDMK36HAX4CM Turion 64 Mobile 2.0GHz CPU

Part Description	AMD Turion 64 Mobile 2.0GHz Processor
Part Number	TMDMK36HAX4CM , MK-36
Package Type	638-pin lidless micro-PGA , Socket S1
Bus speed	800MHz HyperTransport
L2 cache size	512KB
Info.	Size: 1.38" x 1.38" (3.5 cm x 3.5 cm)

AMD TURION 64 X2 RM-70 TMRM70DAM22GG 2.0GHZ SOCKET-S1 DUAL CORE MOBILE PROCESSOR

Type	CPU / Microprocessor
Market segment	Mobile
Family	AMD Turion 64 X2 Mobile technology
Model number	RM-70
CPU part number	TMRM70DAM22GG
Stepping codes	ABAEB BA   CBAEB BA   CBAJB BA   NBAEB BA   NBAJB BA   OBALB BA
Frequency (MHz)	2000
Bus speed (MHz)	Dual-channel 400 MHz DDR2 SDRAM Memory controller One 1800 MHz 16-bit HyperTransport link
Clock multiplier	10
Package	638-pin lidless micro-PGA
AMD Package number	29882
Socket	Socket S1 (S1g2)
Size	1.38" x 1.38" / 3.5cm x 3.5cm
Introduction date	Jun 4, 2008
Architecture / Microarchitecture
Processor core	Lion
Core stepping	B1
Manufacturing process	0.065 micron SOI
Data width	64 bit
Number of cores	2
Floating Point Unit	Integrated
Level 1 cache size	2 x 64 KB 2-way associative instruction cache 2 x 64 KB 2-way associative data cache
Level 2 cache size	2 x 512 KB 16-way associative exclusive cache
Physical memory	1 TB
Virtual memory (TB)	256
Features	MMX technology 3DNow! SSE SSE2 SSE3 AMD64 technology  Virtualization technology Enhanced Virus Protection
Low power features	Enhanced PowerNow! technology  Independent Dynamic Core technology  Dynamic Power management CoolCore technology
On-chip peripherals	Dual-channel DDR2 SDRAM memory controller HyperTransport technology
Electrical/Thermal parameters
V core (V)	1.075 - 1.125
Maximum operating temperature (°C)	100
Thermal Design Power (W)	31

AMD TMDTL52HAX5CT Turion 64 X2 TL-52 Taylor 1.6GHz 2 x 512KB
 L2 Cache Socket S1 35W Dual-Core Processor - OEM

Model
Brand	AMD
Series	Turion 64 X2
Model	TMDTL52HAX5CT
Specifications
CPU Socket Type	Socket S1
Core	Taylor
Multi-Core	Dual-Core
Name	Turion 64 X2 TL-52
Operating Frequency	1.6GHz
Hyper Transports	1600MHz
L1 Cache	128KB+128KB
L2 Cache	2 x 512KB
Manufacturing Tech	90 nm
64 bit Support	Yes
Hyper-Transport Support	Yes
Virtualization Technology Support	Yes
Multimedia Instruction	MMX, SSE, SSE2, SSE3, 3DNOW! Professional
Thermal Design Power	35W
Cooling Device	None, CPU Only
Packaging	OEM

Celeron 2.4 GHz / 128 KB / 400 MHz - Socket 478 - SL6VU

General information
Type CPU / Microprocessor
Family Intel Celeron
Part number BX80532RC2400B
RK80532RC056128
Processor markings 2.40GHZ/128/400
Frequency (MHz) 2400
Bus speed (MHz) 400
Clock multiplier 24
Package 478-pin FC-PGA2
Socket/Slot type Socket 478 (mPGA478B)

Architecture / Microarchitecture / Other
CPUID 0F29h
Core stepping D1
Processor core Northwood-128
Manufacturing technology (micron) 0.13
L2 cache size (KB) 128
Core voltage (V) 1.25 - 1.525
Case/Junction temperature (°C) 71

INTEL (KP 850/256) 7114A336 SL53L

INTEL 735A SL8BA 1.7 2M 400

Type	CPU / Microprocessor
Market segment	Mobile
Family	Intel Pentium M Dothan
Model number	735A
CPU part number	RH80536GC0292MT (SL8BA)
Frequency (MHz)	1700
Bus speed (MHz)	400
Clock multiplier	17
Package	478-pin micro FC-PGA 1.38" x 1.38" (3.5 cm x 3.5 cm)
Architecture / Microarchitecture
Processor core	Dothan
Manufacturing process	0.09 micron 140 million transistors
Data width	32 bit
Floating Point Unit	Integrated
Level 1 cache size	32 KB instruction cache 32 KB write-back data cache
Level 2 cache size	2 MB
Multiprocessing	Uniprocessor
Features	MMX technology SSE SSE2
Low power features	AutoHALT mode  Stop Grant mode  Sleep mode Deep Sleep mode  Deeper Sleep mode Dynamic FSB power down Enhanced SpeedStep technology

INTEL CELERON 380 1.6/1M/400 SOCKET PPGA478

Intel Celeron M 380 1.6GHz 1M 400MHz Socket 479 SL8MN OEM 

Type	CPU / Microprocessor
Market segment	Mobile
Family	Intel Celeron M
Model number	380
CPU part number	RH80536NC0251M (QGXE, SL86H, SL8MN)
Box part number	BX80536NC1600EJ (SL86H, SL8MN)
Frequency (MHz)	1600
Bus speed (MHz)	400
Clock multiplier	16
Package	478-pin micro FC-PGA 1.38" x 1.38" (3.5 cm x 3.5 cm)
Sockets	Socket 479 (mPGA479M) Socket mPGA478C
Architecture / Microarchitecture
Processor core	Dothan
Core stepping	C0 (QGXE, SL8MN)
Manufacturing process	0.09 micron
Data width	32 bit
Floating Point Unit	Integrated
Level 1 cache size	32 KB instruction cache 32 KB write-back data cache
Level 2 cache size	1 MB 8-way set associative
Features	MMX technology SSE SSE2 Execute disable bit

Intel Celeron Mobile Dual Core T4200 2.0GHz 1M 800G Socket P SLAVG OEM MDS

General information
Type	CPU / Microprocessor
Family	Intel Pentium Dual-Core Mobile
Processor number	T4200
Part number	AW80577GG0411MA
Processor markings	AW80577 T4200 2.00/1M/800
Frequency (GHz)	2
Bus speed (MHz)	800
Clock multiplier	10
Package type	478-pin Micro-FCPGA
Socket type	Socket P
Architecture / Microarchitecture / Other
Core stepping	R0
Manufacturing technology (micron)	0.045
Number of cores	2
L2 cache size (MB)	1
Features	EM64T technology Enhanced SpeedStep technology Execute disable bit
Case temperature (°C)	105
Thermal Design Power (Watt)	35

Intel Pentium 4 531 SL9CB 3/1M/800 Socket 775

Type	CPU / Microprocessor
Family	Intel Pentium 4
Processor number	531
Part number	HH80547PG0801MM BX80547PG3000EK
Frequency (GHz)	3
Bus speed (MHz)	800
Clock multiplier	15
Package type	775-land FC-LGA4
Socket type	Socket 775 (LGA775)
Architecture / Microarchitecture / Other
CPUID	0F49h
Core stepping	G1
Processor core	Prescott
Manufacturing technology (micron)	0.09
L2 cache size (KB)	1024
Features	EM64T technology Execute disable bit Extended Halt state Hyper-Threading technology
Core voltage (V)	1.25 - 1.4
Case temperature (°C)	67.7

Intel Pentium III Mobile KP 700/256 SL4JZ

Manufacturer: Intel
Type: Microprocessor
Introduced: June 2000
Name (codename): Mobile Pentium III 750MHz (Geyserville)
Code (Copyright): KP 750/256 (Intel '00)
Specification number: SL53P
Core speed: 750MHz (600MHz SpeedStep)
BUS: 100MHz, 32-bit
Transistors (Die size): 28 000 000 (105mm square)
Technology: 0.18-micron
L1/L2 cache: 16kB+16kB / 256kB (on die, full speed)
Can address: 4GB of physical and 64TB of virtual memory
FPU: Integrated
Whetstone FPU:  MFLOPS
Drystone ALU: MIPS
V core (speedstep/typical/max.): 1.35V - 1.6V(1.485V~1.64V) - 2.1V
Power dissipation (min./max.): ?W - 24.6W
Operating temperature (min./max.): 0 - 100°C
Package (Socket): Micro PGA2 475-pin (Socket 475)
Dimensions: 31.2 x 28.3 x 4.5mm

intel Pentium M 1500MHz Socket 478 Processor

• SKU: SL6F9A - RH80535 1500/1M
• Stock #: SL6F9A
• Item #: RH80535 1500/1M
• Brand: intel
• Type: Mobile
• Availability: In Stock

Intel® Celeron® Processor 530 (1M Cache, 1.73 GHz, 533 MHz FSB) Socket P

Clock Speed	1.73 GHz
L2 Cache	1 MB
Bus/Core Ratio	13
FSB Speed	533 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	65 nm
Max TDP	27 W
VID Voltage Range	0.95V-1.30V

Package Specifications
TCASE	100°C
TJUNCTION	100°C
Package Size	35mm x 35mm
Processing Die Size	143 mm2
# of Processing Die Transistors	291 million
Sockets Supported	PGA478, PPGA478

Intel® Celeron® Processor 540
(1M Cache, 1.86 GHz, 533 MHz FSB)

SPECIFICATIONS

Package Specifications
TCASE	100°C
TJUNCTION	100°C
Package Size	35mm x 35mm
Processing Die Size	143 mm2
# of Processing Die Transistors	291 million
Sockets Supported	PPGA478

Intel® Celeron® Processor 550 (1M Cache, 2.00 GHz, 533 MHz FSB)

Clock Speed	2 GHz
L2 Cache	1 MB
Bus/Core Ratio	15
FSB Speed	533 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	Yes
Supplemental SKU	No
Lithography	65 nm
Max TDP	31 W
VID Voltage Range	0.95V-1.30V

Package Specifications
TJUNCTION	100°C
Package Size	35mm x 35mm
Processing Die Size	143 mm2
# of Processing Die Transistors	291 million
Sockets Supported	PBGA479, PPGA478

Intel® Core™ Duo Processor T2400 (2M Cache, 1.83 GHz, 667 MHz FSB)

SPECIFICATIONS

Package Specifications
TJUNCTION	100°C
Package Size	35mm x 35mm
Processing Die Size	90 mm2
# of Processing Die Transistors	151 million
Sockets Supported	PBGA479, PPGA478

Intel® Core™ Duo Processor T2600
(2M Cache, 2.16 GHz, 667 MHz FSB)

SPECIFICATIONS

Package Specifications
TJUNCTION	100°C
Package Size	35mm x 35mm
Processing Die Size	90 mm2
# of Processing Die Transistors	151 million
Sockets Supported	PBGA479, PPGA478
Halogen Free Options Available	No

Processador Notebook Sempron 3000+ 1.8 Ghz 754 Sms3000bqx2f

Тактовая частота: 1.83 ГГц, Кэш-память второго уровня: 1024 Кб., Частота шины: 800 МГц

Тактовая частота: 1.9 ГГц, Кэш-память второго уровня: 512 Кб., Частота шины: 800 МГц

Тактовая частота: 1.6 ГГц, Кэш-память второго уровня: 1024 Кб., Частота шины: 800 МГц

Тактовая частота: 2.00 ГГц, Кэш-память второго уровня: 1024 Кб., Частота шины: 800 МГц